Tie Hu

Tie Hu has a diverse work experience spanning over two decades. Tie currently serves as a Sr. Robotics Engineer at Hyperfine Research, Inc. since 2018. Prior to this, they worked at Amazon as a Sr. Electricalmechanical Engineer from 2015 to 2018.

Tie also held the position of Sr. Mechanical Design Engineer at Olympus from 2008 to 2015. Before that, Tie Hu worked as a Postdoctoral Research Scientist at Columbia University from 2006 to 2008.

In the early years of their career, Tie Hu served as a Research Assistant at Drexel University from 2001 to 2006. Tie also worked as an Automation Engineer at PERLOS (Guangzhou) Engineering Plastic Co. Ltd from 1999 to 2001.

Tie Hu obtained a Bachelor of Engineering (B.E.) degree in Mechatronics Engineering from South China University of Technology, where they studied from 1994 to 1999. Later, they pursued a Master's degree in Mechanical Engineering at Drexel University from 2001 to 2003. Finally, Tie Hu completed their education at Drexel University with a Ph.D in Robotics, which they obtained from 2001 to 2006.