William Field

William Field currently serves as the Vice President of Customer Success at HYPR since September 2024. Additionally, William has been a Board Member at JetSweep since May 2020. Prior experience includes roles as Director of Customer Success at Spacelift from August 2022 to September 2024, and various positions at Trilio from November 2016 to August 2022, culminating in the role of VP, Solutions Architecture and Customer Success. William also held the position of Principal Solutions Architect at Actifio from August 2012 to November 2016 and served as a Senior Software Engineer at EMC from April 2006 to April 2012. William holds a Bachelor of Science in Computer Engineering from the University of New Hampshire and is pursuing a Master's Degree in Information Technology Management at Brandeis University, alongside an Associate degree in Computer Engineering Technology from Vermont Technical College.