• IBM

Adam Gennett

Plasma Etch R&D Engineer

Adam Gennett is an experienced engineer with a strong background in materials science and engineering. Gennett served as a Research Assistant at Rensselaer Polytechnic Institute from 2007 to 2011, focusing on bulk crystal growth for photovoltaic and LED applications. Following academic pursuits, Gennett worked as a Field Process Engineer at Lam Research from 2012 to 2018, specializing in front-end-of-line etch process development for advanced technology nodes. Gennett then advanced to a Principal Process Engineer position at GLOBALFOUNDRIES from 2019 to 2023, responsible for managing fin etch processes for 14nm device manufacturing. Currently serving as a Plasma Etch R&D Engineer at IBM, Gennett continues to contribute to innovations in semiconductor processing. Gennett holds both a Bachelor of Science in Physics and a Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute.

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Saratoga County, United States

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