Bo Liang is a Senior Design for Test Engineer at IBM, where they analyze test coverage of design macros and develop manual test patterns for various chip features. With 3 years of design for test experience on high-end custom processors and 4 years in digital/analog integrated circuits, Bo has also contributed to consumer electronics product development. They hold a B.S. in Telecommunication Engineering and an M.S. in both Electrical and Electronic Engineering from Huazhong University of Science and Technology and the University of Nebraska-Lincoln. Before joining IBM in 2012, Bo worked as a design engineer and served as a teaching assistant.
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