Cheng Tan is a Research Staff Member at IBM, where they contribute to innovative projects following their experience as a Device Integration Engineer at Intel Corporation from 2020 to 2022. Cheng completed a PhD in Electrical Engineering at Columbia University in 2020, where they also served as a Graduate Research Assistant. Prior to their doctoral studies, Cheng earned a Master’s degree in Materials Science and Engineering from The University of Texas at Austin and an Honors Bachelor of Science in Electrical and Computer Engineering from Oregon State University. Their diverse skillset includes materials investigation, device fabrication, and advanced measurements techniques.
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