Eric Campbell is a Senior Hardware Development Engineer and IBM Master Inventor at IBM, with extensive experience in the information technology and services industry. They earned a Bachelor of Science in Materials Science and Engineering from the University of Wisconsin-Madison. Previously, they held positions at Voyles Lab as a Laboratory Assistant and at Oshkosh Corporation as a Materials and Process Co-op, where they performed failure analysis and material evaluations. Since 2013, Eric has contributed significantly to IBM, leading materials characterization for IBM Systems products and actively influencing mechanical design and reliability. Eric was named an IBM Master Inventor in 2017, recognizing their expertise and innovative contributions.
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