Jun Liu is a knowledgeable professional in semiconductor process integration with extensive experience in the field. They earned a PhD in Chemistry from Northwestern University and previously held a Master's and Bachelor's degree in Polymer Chemistry and Physics. Jun has contributed to leading organizations including IBM, GLOBALFOUNDRIES, and HFC Semiconductor Corp., working in roles such as Senior Engineer and STSM, focusing on FEOL/MOL integration and MRAM device development. They are currently engaged in FEOL/MOL process integration at IBM in Albany, NY.
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