Kevin Brew

Kevin Brew is a Senior Semiconductors Hardware Engineer specializing in Materials R&D for Chiplet, Logic, and AI at the IBM AI Hardware Center in Albany, NY. They lead unit process engineering in AI Hardware and Integration research, focusing on innovative phase-change and resistive memory materials. In 2020, Kevin became an IBM Master Inventor and has contributed to the development of IBM's first 300 mm multi-level PCM. They previously worked as a doctoral researcher at Purdue University, where they developed new nanoparticle chemistries for solar applications, and hold a Bachelor’s degree in Chemical Engineering from the University of Delaware.