Michael Rizzolo, Ph.D., MBA, is a Senior Engineer and IBM Master Inventor with extensive experience in semiconductor integration. They served as an IBM/SRC Graduate Fellow at the College of Nanoscale Science and Engineering of the University at Albany from 2011 to 2014, focusing on copper interconnect microstructure. From 2014 to 2019, they worked at IBM Research, integrating MRAM into advanced semiconductor processes. They hold a Ph.D. in Nanoscale Engineering and an MBA from the State University of New York at Albany, along with a B.S. in Mechanical Engineering from Tufts University.
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