Ryan Elsasser, PE, has a diverse background in mechanical engineering and design, with a Bachelor of Science from Clemson University and a Master of Science from Penn State University. Initial experience includes roles as a procurement and turbine design engineer intern at GE Power & Water. From May 2012 to September 2021, Ryan worked at IBM in various capacities, including mechanical design engineer, R&D interconnect engineer, lead mechanical engineer, and product fulfillment engineer, contributing to projects such as IBM Power E950 & E1050 servers and the Watsonx PCIe adapter. Ryan's focus has been on research and development, hardware design, and enhancing signal interconnect technologies.
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