TONGQING CHEN currently serves as the Etch Process Lead at IBM since August 2025, having transitioned into this new role. Prior experience includes serving as the Etch Dep Senior Manager at Hefechip Semiconductors from December 2018 to July 2025. TONGQING CHEN also held a position as a Member of Technical Staff at GlobalFoundries from July 1995 to November 2018, focusing on dry etch process engineering for technologies ranging from 0.8 µm to 7nm. Earlier in the career, TONGQING CHEN worked as an engineer at Chartered Semiconductor from 1995 to 2009. Educational background includes studies at Beijing National Day School and Zhejiang University.
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