Timothy Lee is currently the President of IEEE-USA for 2025 and serves as a Boeing Technical Fellow specializing in advanced microelectronics and packaging. They have held various leadership positions, including past IEEE Region 6 Director and member of the IEEE Board of Directors from 2021 to 2022. With a commitment to using technology for humanitarian purposes, Timothy has chaired multiple initiatives related to internet inclusion and emergency communications, emphasizing workforce development and diversity within the technology field. They continue to advocate for IEEE's role in leveraging federal programs to support semiconductor workforce growth and enhance community engagement. Timothy is pursuing a degree in Electrical and Electronics Engineering at the Massachusetts Institute of Technology.
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