Lan Peng

Lan Peng has extensive experience in the field of semiconductor research and development, currently serving as an R&D Manager at imec since September 2012, where responsibilities include overseeing wafer bonding and assembly processes for chiplet heterogeneous integration and advanced packaging. Prior roles at imec included Team Leader for Process Engineering in Bonding and Assembly, and Senior R&D Engineer, focusing on joint development programs and process validation in wafer-level bonding related to various advanced applications. Previous experience includes a PhD Attachment at the Institute of Microelectronics, A*STAR, and a position as a Process Engineer at Micron Technology, emphasizing process optimization and equipment effectiveness. Lan Peng holds a Ph.D. and a Bachelor of Engineering in Electrical and Electronics Engineering from Nanyang Technological University Singapore.