Soon Aik Chew is a highly skilled and results-driven Principal Member of Technical Staff with extensive experience in process integration and engineering. They began their career as a Flip Chip Engineer at ASE Group Global before advancing to various roles, including Senior Process Integration Engineer at Systems on Silicon Manufacturing Company and R&D Process Integration Engineer at imec. Soon Aik has been actively involved in cutting-edge projects, such as wafer-to-wafer hybrid bonding, and has a strong academic background with a Master’s degree in Electrical and Electronics Engineering from Universiti Teknologi PETRONAS. Currently, they lead integration efforts at imec while continuously contributing to innovative semiconductor technologies.
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