Alexander Dyck is a Dr.-Ing. and electrical engineer specializing in passive millimeter wave technology, simulation, MMIC packaging, antennas, and RF connectors. They have several years of experience in system development, particularly in the submillimeter wavelength range, and have recently led projects in the RF domain focused on 5G mobile communications. Alexander held various roles at Huawei, including Senior R&D Engineer and R&D Engineer, where they managed projects and developed novel packaging technologies. They also served as a lecturer in physics at the Deutsche Angestellten Akademie from 2022 to 2024 and worked as a scientific employee at Fraunhofer IAF, contributing to the development of sub-THz modules. Currently, they are the Head of RF Development at IMS Connector Systems Group.
Location
Freiburg, Germany
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