Steve Payne

Steve Payne has had a long and varied career in the electronics industry. Steve began their career in 1980 as the Manager of the PCB Division of GEC Marconi. In 1993, they became the Manager of Advanced Products for Kam Circuits and was also a Business Consultant for Cirflex Technology. From 2008 to 2014, they were the Director of Endicott Interconnect Technologies Inc. in Europe. In 2014, they began working for iNEMI as the Project Manager and Manager of European Operations. In this role, they coordinated and facilitated the iNEMI PCB & Laminate Technology Implementation Group (TIG). Steve also managed a variety of collaborative projects and initiatives, such as PCB & PCBA Material Characterization for Harsh Environments, Best Practices for Expanded Beam Connectors in Data Centres, Reliability & Loss Properties of Copper Foils for 5G Applications, PCB Characterization for CAF and ECM Failure Mitigation, Hybrid PCBs for Next Generation Applications, PCB Connector Footprint Tolerances, and Liquid Immersion Cooling of PCB assemblies. Steve also supported additional project proposals for “PCB Level Interconnect for Co-Packaged Optics” and “PCB Pad Cratering and Pad Lift Characterization and Mitigation”.

Steve Payne attended Anglia Ruskin University, where they studied Applied Physics (METC). Steve also attended Chelmsford Technical High School.