Dison Lim is a seasoned professional in package development, currently serving as the Director of Package Development. With a history of significant roles at Infineon Technologies from 2017 to 2023, including Senior Manager of Package Technology Development and Principal Engineer - FE & BE Integration, Dison has demonstrated expertise in process engineering and integration. Prior to this, Dison worked as a Supplier Quality Engineer at TEAC Electronics (M) Sdn Bhd in 2007-2008. Dison holds a Bachelor of Science and a Master of Physics from Universiti Sains Malaysia.
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