Roger Cho

Principal Engineer UPE Hot Soft Solder Die Bond

Roger Cho is a Senior Staff Engineer at Infineon Technologies, where they focus on package technology and die bonding processes. They began their career in June 2011 after earning a degree in Manufacturing Engineering from the University of Malaya. Roger has received multiple accolades, including the Gold Illumination Award at ICQCC 2015 and the Gold Medal Award at the Southern Regional Convention on Team Excellence in 2014. Their extensive experience includes roles at Besi Netherlands B.V., where they provided technical support and coordinated solutions for ESEC machine platforms globally.

Location

Melaka, Malaysia

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