Ryan Geries is a Mixed Signal Design Verification Engineer at Infineon Technologies and has held various engineering roles throughout their career. They served as an Electrical Engineer Co-op at Kimberly-Clark in 2011, and contributed to RF/Analog IC design as a Graduate Research Assistant at Texas Tech University from 2012 to 2014. Ryan worked at Texas Instruments from 2014 to 2016 as a Design Verification Engineer and continued to hone their skills at Lockheed Martin as an Embedded Software Engineer from 2016 to 2018. Prior to their current role at Infineon, they were a Senior Member Technical Staff at Allegro MicroSystems in 2023. Ryan holds a Master's Degree in Electrical Engineering, having graduated from Texas Tech University with a GPA of 3.9.
This person is not in the org chart
This person is not in any teams
This person is not in any offices