Steven Wan is a highly experienced professional in Process Package Development Engineering with over 20 years of expertise in managing successful package development projects. Currently serving as the Director of Unit Process Development at Infineon Technologies, they previously held various roles including Principal Process Package Development Engineer and Senior Process Development Engineer at onsemi and ON Semiconductor, respectively. Steven's background includes a strong focus on die attach technology and advanced bonding techniques, contributing significantly to efficiency and project delivery. They earned an Advanced Diploma in Mechanical and Manufacturing from Tar College and a Bachelor's degree in Mechanical Engineering from Liverpool John Moores University.
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