Thomas Lehmann is a seasoned professional with extensive experience in package development and management in the semiconductor industry, currently serving as Senior Director of Package Development Chip Card at Infineon Technologies since September 2005. Lehmann's career at Infineon includes leadership roles in post-merger integration, productivity management, and package development for sensors, discretes, and logic packages, overseeing teams of up to 70 engineers across global locations. Prior to Infineon, Lehmann worked at Wacker Chemie AG as Technical Marketing Manager for North America and led development at 3M ESPE, where several patents were filed. Academic qualifications include an MBA from Henley Business School, a German Diploma in Chemistry from the University of Bayreuth, and a PhD in Polymer Chemistry from the Max Planck Institute.
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