Thorsten Meyer is a distinguished engineer at Infineon Technologies, having been with the company since March 2015, where responsibilities have included various leadership roles in package concept engineering. Prior experience includes serving as a principal and senior manager at Intel Mobile Communications from February 2011 to February 2015, focusing on package technology innovation. Earlier in the career, Thorsten held project management positions at Infineon Technologies from September 1999 to February 2011, contributing to the development of advanced packaging technologies such as softbump and eWLB. Additionally, a background as a development engineer at Epcos AG involved the development of Flip-Chip technology. Thorsten holds a Diplom in Fertigungstechnik from FAU Erlangen-Nürnberg and attended Rhön-Gymnasium.
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