AK

Akshaya Kulkarni

Packaging R&D Engineer

Akshaya Kulkarni is a Process Integration Engineer at Intel Corporation, where they currently support the development of key technologies such as Foveros and EMIB. Previously, Akshaya served as a Process TD Engineer at Intel, focusing on plasma dry etch process development and die yield improvement. They have also gained experience as a Process Engineering Intern at Lam Research and held internships at The Dow Chemical Company and Lubrizol India Pvt Ltd. Akshaya earned a Bachelor of Engineering in Chemical Engineering from the Institute of Chemical Technology and a Master of Engineering in Chemical Engineering from Texas A&M University.

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Hillsboro, United States

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