Amol Kirtikar

Amol Kirtikar is a seasoned professional with 30 years of experience in microelectronic packaging, emphasizing technical and operational leadership. At Intel Corporation, they have held various roles, including Director of Wafer Level Assembly Integration, where they manage the startup of high-volume manufacturing processes. Previously, Amol served as a New Technologies Transfer Program Manager and has extensive experience in driving yield improvements and technology transfers globally. Amol holds master's degrees in Metallurgy & Materials Science from Stony Brook University and Materials Science & Engineering from Stanford University.