Baosuo Zhou

Baosuo Zhou is a Principal Engineer and Engineering Manager at Intel, where they define roadmaps and strategies while leading cross-site efforts in hardware and process solutions for 3D NAND high aspect ratio etch. They previously served as a Senior Member of Technical Staff at Applied Materials, focusing on critical DRAM and 3D NAND etch applications, and held roles at Lam Research and Micron Technology, where they developed advanced etch processes and patterning technologies. With a robust background in engineering and problem-solving, Baosuo collaborates effectively with technical teams to deliver innovative solutions. They are pursuing a Master of Science degree at the University of California, Santa Barbara, and hold a PhD from The University of Texas at Dallas.