Brian Jarrett is a Staff Thermal Mechanical Engineer and Technical Lead at Intel, specializing in mechanical and thermal engineering of electronic systems. Previously, they held positions as an Electronics Designer at Siecor Corporation and a Contract Mechanical Engineer at RadiSys Corporation, focusing on mechanical development for telecommunication equipment. With extensive experience in PCB layout, heat sink design, and system cooling strategies, Brian has worked on various automated test and packaging equipment throughout their career. Their technical expertise includes ProEngineer, FloTherm, and IcePak, reflecting a strong background in mechanical design and CFD analysis.
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