Brian Peil is an experienced engineering leader with a strong background in hardware engineering, currently serving as the Director of Hardware Engineering for the Data Center & Artificial Intelligence Group at Intel Corporation since March 2019. In this role, Brian leads the Cloud Engineering Hardware team, focusing on Xeon-based server designs and technology innovations for Tier 1 cloud service providers and original design manufacturers. Prior to this position, Brian held various senior engineering roles at Intel, including Director of Engineering for Xeon Performance Architecture and multiple senior engineering manager positions across programmable solutions, client computing, and media hardware development. Brian's earlier career included system design engineering roles at both Intel and Dell Technologies, with contributions to high-end server subsystems and innovative consumer electronic platforms. Brian holds an education from the Rochester Institute of Technology.
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