Brian Smith

Brian Smith is a skilled engineer with a solid background in integrated circuit (IC) design and analog design, having held various positions in prominent technology companies. Experience includes serving as a Physical Design Intern at MediaTek, an IC Design Engineer at Broadcom Limited where Brian ran SerDes simulations and worked on PLL subsystem implementation, and as an HSIO Analog Design Engineer at Intel Corporation. Prior engagements include work at Avago Technologies as a SerDes IC Design Engineer. Currently, Brian is a SoC Design Engineer at Intel Corporation. Brian holds a Bachelor of Science in Electrical and Electronics Engineering from the University of Michigan and a Master’s degree in Electrical Engineering from Colorado State University, achieving a perfect GPA of 4.0.