Brian Thompson

Senior Staff Engineer, Chemical Mechanical Planarization (CMP)

Brian Thompson is a Senior Staff Engineer specializing in chemical mechanical planarization (CMP) at Intel Corporation, where they lead technical efforts in high volume manufacturing for advanced technology nodes. They previously held roles as a Process Engineer at Washington River Protection Solutions and a Graduate Research Associate at Arizona State University, where their work included significant contributions to nuclear waste management and innovative research in chemical engineering. Brian holds a Ph.D. in Chemical Engineering from Arizona State University and a B.S. in Chemical Engineering from Washington State University.

Location

Phoenix, United States

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