Craig Weinman is currently a Yield Development Manager at Intel, where they have built a successful career in semiconductor electronic packaging since 2009. After graduating summa cum laude with a BS in Chemistry-Engineering from Washington & Lee University, Craig pursued a Ph.D. in Materials Science at Cornell University, focusing on polymer synthesis and characterization. At Intel, they have held various positions, including Staff Packaging Engineer and Engineering TD Manager, where they have led teams and developed expertise in low yield analysis, soldering processes, and complex problem-solving. With a strong background in academia and industry, Craig enjoys solving challenging technical issues and fostering the development of their team members.
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