Darren Ho is a Principal Engineer at Intel Corporation, where they currently contribute to the Chipset Group. With a B. Eng in Electrical Electronics from Universiti Teknologi Malaysia, Darren previously held various engineering roles at Intel from 2002 to 2006, including Component Design Engineer and Analog Design Engineer. They have led teams in developing high-speed I/O architectures for next-generation chipsets and have a strong track record in circuit innovation, receiving multiple patents and company recognition for their work.
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