Fabio Galanello is a seasoned engineering professional with extensive experience at Intel Corporation since August 2011, where roles range from Process Integration Development Manager to Sr. Staff Yield/Integration Engineer, leading initiatives in manufacturing process improvement and 7nm process development. Prior to Intel, Fabio worked at Micron Technology as a Process R&D Integration Engineer, contributing significantly to the Cu BEOL integration and the development of image sensors. Earlier career stages include roles at Italtel - Tecnosistemi Group and IESS, where expertise in systems engineering, network configuration, and MEMS device development was gained. Fabio holds a Master's degree in Electrical and Electronics Engineering from Università degli studi Roma TRE.
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