Irene Cheung

Wafer Assembly TD FE Technical Program Manager at Intel

Irene Cheung has extensive experience in the semiconductor industry, currently serving as a Wafer Assembly TD FE Technical Program Manager at Intel Corporation since November 2021, following a tenure as an NVM Senior Process Integration Engineer. Prior experience includes a long-term role at Micron Technology, where Irene held various positions, including DRAM Principal Process Integration Engineer and DRAM Sr Process Integration Engineer, focusing on process development in DRAM technology. Irene's earlier work includes a Senior Scientist position at Quanlight, Inc., conducting wafer characterization and analysis for LED development, and postdoctoral fellowships at the Pacific Northwest National Laboratory and the University of Wisconsin - Milwaukee, specializing in electronic structure characterization and MBE growth of spintronics materials. Irene holds a PhD in Physics from The University of Hong Kong, earned between 1998 and 2002.

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Intel

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Intel put the silicon in Silicon Valley. For more than 50 years, Intel and its people have had a profound influence on the world, driving business and society forward by creating radical innovation that revolutionizes the way we live. Intel’s mission is to shape the future of technology to help create a better future for the entire world. By pushing forward in fields like AI, analytics and cloud-to-edge technology, Intel’s work is at the heart of countless innovations. From major breakthroughs like self-driving cars and rebuilding the coral reefs, to things that make everyday life better like blockbuster effects and improved shopping experiences — they’re all powered by Intel technology. Today Intel is applying their reach, scale, and resources to enable customers to capitalize more fully on the power of digital technology. Inspired by Moore’s Law, they continuously work to advance the design and manufacturing of semiconductors to help address their customers’ greatest challenges. By embedding intelligence in the cloud, network, edge, and every kind of computing device, Intel unleashes four superpowers: AI, pervasive connectivity, cloud to edge, and ubiquitous computing. These four extraordinary technological capabilities have become major market forces powering the digitization of everything.


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