Jagadeesh Radhakrishnan

Jagadeesh Radhakrishnan is a Platform Thermal Architect at Intel Corporation, where they have developed extensive expertise in thermal and mechanical performance evaluation over 15 years. Previously, they held multiple roles at Intel, including Senior Quality and Reliability Engineer and ThermoMechanical Packaging Engineer, focusing on product testing, modeling, and reliability data support. Jagadeesh began their career with a student internship at Advanced Micro Devices (AMD), where they conducted thermal evaluations and mechanical modeling. They earned a B.Tech in Mechanical Engineering from the Indian Institute of Technology, Madras, and an M.S. in Mechanical Engineering from the University of Maryland.