Jason Ng is an Engineering Manager at Intel Corporation, where they lead high-volume manufacturing for the Chip Attach Module and manage the development of cutting-edge server platform technology. Previously, they served as a Senior Process Engineer and Engineering Technologist at Intel, driving innovation and yield improvements in manufacturing processes. Jason also has experience as a Project Management Specialist at HGC Global Communications and completed an internship at Robert Bosch Tool Corporation. They hold a Master's Degree in Mechanical Engineering from the University of Nottingham, earned in 2014.
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