Jason Zhang, Ph.D., is a widely recognized senior engineering technical leader with over 28 years of experience in the field. They completed their Ph.D. in Materials Science and Engineering at the University of Pennsylvania, where they investigated corrosion fatigue mechanisms and developed novel sensors and materials for aeronautic applications. Currently a Senior Principal Engineer at Intel Corporation, Zhang drives advanced packaging technology development, defining roadmaps and collaborating with industry partners to enhance performance and reliability. Their prior roles at Intel showcase a notable history of leadership in technology pathfinding and innovation in electronic packaging.
Location
Chandler, United States
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