Jia Xin C. is a SoC Structural Design Engineer currently pursuing a Master of Engineering in Electronic Systems at Universiti Tunku Abdul Rahman (UTAR). Jia Xin has previously held the position of Head of the Engineering Technology Division at The Institution of Engineers Malaysia - UMP Student Section from 2019 to 2021 and completed internships at Top Glove and Mei Jia Electronic Sdn. Bhd. Additionally, Jia Xin served as a Graduate Trainee at Intel Corporation from 2022 to 2023. With a solid academic background that includes a First Class Honours bachelor's degree in Electronics Engineering Technology from Universiti Malaysia Pahang, Jia Xin is committed to utilizing and enhancing skills in a professional environment.
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