Jianghu Yan is an experienced engineer with a strong background in process integration within the semiconductor industry. Notable positions include Principal Process Integration Engineer at Chartered Semiconductor Manufacturing Inc. from April 2006 to April 2010, where 65nm/45nm FEOL technology development was a primary focus. As a Senior Process Engineer at HHNEC from July 1998 to April 2006, expertise in 0.25um RF and eFlash process integration was demonstrated. Jianghu Yan held the role of Senior Member of Technical Staff at GlobalFoundries from December 2016 to January 2022, leading projects on 40nm eNVM technology development and automotive reliability qualifications, as well as contributing to 14nm FinFET technology transfers. Currently, as Senior Staff Process Integration at Intel Corporation since February 2022, efforts are concentrated on Intel 7 FinFET yield improvement and technology transfer. Education includes a Master of Engineering in Electrical, Electronics, and Communications Engineering from the National University of Singapore, along with a master's from Fudan University and a bachelor's from Shanghai University.
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