Jon Tien is a Staff Quality & Reliability Engineer at Intel Corporation, having advanced from a Senior Quality & Reliability Engineer role from 2016 to 2022. Prior to this, Jon worked as a Senior Device Engineer at Microsemi Corporation from 2011 to 2016 and held internships in technology development. Jon also served as a Product Development Engineer at NXP Semiconductors from 2008 to 2009, and contributed to artificial intelligence research at York University during 2007 to 2008. Jon earned a Bachelor of Engineering degree from McMaster University in 2008.
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