Joyce (Yue) Gong is a technology research engineer and manager at Intel Corporation, where they have focused on technology research and maturation for advanced systems and packaging since 2022. Prior to this role, Joyce served as a quality and reliability engineer and held several managerial positions, including assembly packaging core technology pathfinding lead, from 2017 to 2020. Joyce holds dual Ph.D. and MSE degrees in Mechanical Engineering from the University of Michigan and a BS in Mechanical Engineering from Shanghai Jiao Tong University.
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