Leo Liu is an experienced engineer and entrepreneur currently serving as a TD Module & Integration Yield Engineer at Intel Corporation, where they lead front-end patterning process development for advanced transistor technologies. Previously, Leo held various roles, including Purchasing Executive at Hsinchu Prosecutors' Office, Research Assistant at National Tsing Hua University, and co-founded Connaisa, a learning platform. Leo's earlier experience includes a private tutoring position and internships at ITRI and TSMC, enhancing their skills in technology research, data analytics, and business development. Leo holds a degree from the University of Illinois at Urbana-Champaign.
Location
Portland, United States
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