Lingyao Meng is a Yield Development Engineer at Intel with over three years of experience in semiconductor yield and reliability engineering. They hold a PhD in Nanoscience and Microsystems Engineering from the University of New Mexico, where they conducted extensive research on structure–property relationships in advanced materials. In their role at Intel, they perform yield and reliability analyses on high-volume manufacturing data and collaborate with cross-functional teams to improve manufacturing yield. Lingyao has also published approximately 20 peer-reviewed articles in prestigious journals.
Location
Seattle, United States
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