KT Cheng Martin is a Silicon Photonics Senior Package R&D Engineer currently at Intel, focusing on the development of optical compute interconnect chiplet co-packages and pluggable transceiver/receiver modules. Previously, they worked as a Bumping Product Engineer and Europe Region Customer Engineering Integration Supervisor at ASE Group Global from 2004 to 2010. They also served as the NTI Project Leader at NXP Semiconductors from 2017 to 2018.
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