Michael Tan is an experienced semiconductor packaging engineer currently serving as an Inspection Pathfinding Staff Engineer at Intel Corporation. Previously, they worked as an Equipment Development Engineer and Packaging Engineer at Intel, where they led multidisciplinary teams and implemented cost-saving projects. Michael’s educational background includes multiple degrees in Mechanical Engineering from the University of Florida, where they also contributed to research on Magnetic Abrasive Finishing and Latent Heat Thermal Storage for solar power applications. Their work has been recognized with awards for excellence in undergraduate research and presented at international conferences.
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