Mihir Oka is an accomplished materials scientist with extensive experience in both academic and industrial settings. From August 2004 to May 2010, Mihir served as a Graduate Research Assistant at the Georgia Institute of Technology, focusing on the process-structure-property relationships of polymers and the characterization of biopolymers while pursuing a PhD in Polymer Science & Engineering. Since July 2010, Mihir has been with Intel Corporation, holding positions such as Sr. Materials R&D Engineer and Staff Packaging Engineer and Technologist, where expertise in semiconductor packaging materials has been developed. Mihir's work includes fundamental research and development for microelectronics packaging, contributing to multiple patent filings and earning the 2018 Intel Achievement Award. Mihir holds an M.S. in Materials Science and Engineering from Clemson University and a B.E. in Polymer Engineering from Savitribai Phule Pune University.
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