Mihir Roy, MBA, Ph.D, currently serves as Engineering Manager - Packaging at Synaptics Incorporated since October 2015, where technology leadership is provided for the Engineering Program Management team in developing biometric products. Roy's extensive career at Intel Corporation spans from August 2005 to the present, holding roles such as Substrate Packaging Program Leader, IC Packaging Platform Integrator, and IC Packaging Core Competency Engineer, focusing on semiconductor packaging roadmaps and integration of technologies across various platforms. Prior experience includes serving as a Graduate Student Research Assistant at Rensselaer Polytechnic Institute from July 2002 to August 2005. Educational credentials include a Ph.D. in Nanodielectrics from Rensselaer Polytechnic Institute, a Master’s degree in Nanotechnology from the University at Albany, and an MBA in Finance & Strategy from Solvay Brussels School of Economics and Management.
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