Milo J.

Milo J. possesses a strong academic background in computer science and electrical engineering from UC Berkeley and Stanford University, where they are currently pursuing a Master's degree in Electronic Engineering Science. Milo began their career as an Assistant Packaging Engineer at Apple, progressed to a Senior Packaging Engineer at Hewlett Packard, and took on the role of Project Manager at Intel Corporation. They now serve as the Associate Director of Packaging Solutions at Intel, overseeing the packaging department and leading innovation in advanced packaging technologies. Driven by a passion for professional growth and a commitment to continuous learning, Milo effectively balances industry expertise with personal development.