Morgan Tribolet is an experienced professional in the semiconductor industry, currently serving as a Senior Technical Program Manager and Package Design Program Manager at Intel Corporation since April 2005. In these roles, Morgan leads and collaborates on the design and development of innovative package and test technologies, while also managing assembly certification for various product lines. Prior to this, Morgan was a Failure Analysis specialist at Texas Instruments from February 2004 to April 2005, focusing on physical failure analysis of electronic devices and identifying solutions for critical failure issues. Morgan holds a degree from the University of Arizona, completed between 2000 and 2003.
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