Sashi Kandanur

Sashi Kandanur is a Principal Engineer at Intel Corporation, with experience since March 2011 in various roles, including Engineering Technology Development Manager and Technologist, specializing in substrate packaging and die embedding technology development, specifically in planarization, electroplating, and backend process technology development. Prior to joining Intel, Sashi served as a Senior Process Engineer, focusing on plating and backend processes, material, and equipment technology development. Sashi's academic background includes a Ph.D. and M.S. in Mechanical Engineering from Rensselaer Polytechnic Institute, and a B.Tech. in Mechanical Engineering from the National Institute of Technology Silchar. Doctoral research involved studying the wear resistance mechanisms of PTFE nano-composites, along with extensive tribological and material characterization.