Stephen Smith is a Semiconductor Packaging Architect at Intel, drawing on a strong background in signal integrity simulation. They previously worked as a Signal Integrity Engineer at Intel Corporation from 2016 to 2022, where they developed modeling methodologies for signal integrity analysis of electrical interconnects. Additionally, Stephen held roles as a Test Intern at Rockwell Automation in 2014, a Technical Specialist at ACSS in 2013, and an Applications Engineering Intern at Texas Instruments in 2015. They earned a Master's Degree in Electrical and Electronics Engineering from Arizona State University, completing their studies in 2016.
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